Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 – 1301 United States is the sole provider of…